Sonix Echo VS Ultrasound Microscope (Acoustic Scanning Microscope)

Sonix

Echo VS

The Acoustic Raster Microscope enables the inspection of packaging.

Features:

To detect the smallest and subtlest defects in state-of-the-art packaged microelectronic applications,
ECHO VS includes standard features such as heated water for optimal acoustic coupling,
flexible TAMI for efficient capture of the most useful data,
Waveform Averaging for improved signal-to-noise ratio, ICEBERG for enhanced image quality, and MFCI for improved image quality in the most demanding applications.
ECHO VS is the ultimate ultrasonic NDT device for molded flip chips, CSP, MCM, stacked die,
MUF, and other advanced packaging technologies.

Detects air defects as small as 0.01 micrometers and resolves defects up to 5 micrometers spatially.
Image enhancement suite with heated water, waveform simulation, and other innovations
for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex Molded Flip Chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Wide range of transducers from very low to ultra-high frequency
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI)

Voltage / Power Consumption:
100-120/220-240 VAC
1PH/N/PE, 50/60 Hz 10 A

Condition: used

Scope of delivery: (See image)

(Changes and errors in technical data are reserved!)

We would be happy to answer any further questions by phone.