Ersa Reflow Soldering System Hotflow 2/12

Ersa

Type: Hotflow 2/12

Reflow Soldering System

The reflow ovens of the Hotflow 2 series from Ersa offer an entry-level model
with a total process length of almost 2.5 m, including 1.7 m heating and 0.8 m cooling section.
The Hotflow 2/12 features up to 12 separately controllable heating and 2 cooling zones.

Specifications of the soldering system:
Six zones
Frequency-controlled fans (monitored) in the reflow zone
Minimal ΔT
Homogeneous temperature distribution for optimal soldering results
Low stress on components and PCBs
Continuous recording of all solder profiles
Reflow soldering under nitrogen possible
Active cooling from above with water cooling
Multi-stage condensate management

2.5m process length
Min./Max. solder width 45-500 mm
High energy efficiency through modern cooling units

Technical Data:
Options:

Process gas cleaning at the outlet
Transport width adjustment - programmable
Automatic chain lubrication system - for transport and center support
Standard PC (laptop) including PC support arm,
ERSAsoft and EPOS basic module

Protective gas technology:
Volume flow: 0-35 m³/h
Pressure monitoring of protective gas supply: 6 bar
Electrical data Hotflow 2/12
UN= 5 conductor network 3x 400V, N, PE +10% -10%
fn 50/60 Hz
max. fuse 3x80A (tr)
P rated 30-48 [40] kW
I rated [44] A

Safety features
Main switch
Emergency stop switch (4x)
Fan monitoring per module
Exhaust monitoring
Two-hand operation
for opening/closing the hood

Extraction:
Extraction nozzles: 2 pieces of 150 mm
Extraction line per nozzle: 400 m³/h

Continuous sound level
<70 dB (A)

Heating system
Connection share: 100%
Volume flow per module: approx. 500m³/h (adjustable)
Convection heating modules: 6 above / 2 or 6 below
of which
Preheating 4 above / optional 4 below
Soldering zone 2 above / 2 below
Rated power per module: 3kW / 400V
Heating time of the soldering system: approx. 20-25 min
max. temperature difference between:
adjacent heating zones
-Example: first preheating 150°C / second preheating 170°C
approx. 20°C (at high absolute temperatures, values
greater than 20°C are achievable)
last preheating and first soldering zone:
Example: last preheating 220°C / first soldering zone 320°C
approx. 100°C

Cooling:
ERSA cooling system
with water recooler
Cooling modules: 2 - above
Regulation: not separately adjustable
Cooling medium: water / air

Ambient temperature
10-35°C

Humidity
20%-95%
(non-condensing)

System dimensions:
Length: 3860 mm Width: 1400 mm
Height: 1370-1500 mm Height (opened) 1720-1850 mm
Weight: approx. 1250 kg

Transport system:
Working width: 50 - 500 mm
Working width with center support: 50 - 500 mm
Pass height: +35 / -20 mm
Transport speed: 20-200 cm/min
Transport height above ground: 820 - 950 mm (standard)
Pin chain transport: 5 mm edge support
(2.85 mm optional)
Min. PCB length: 80 mm

Process zone:
Process length: 2540 mm
Heating section: 1700 mm
Cooling zone: 840 mm
Infeed area: 650 mm
Outfeed area: 650 mm
Width of the process chamber: 690 mm

Condition: used

Scope of delivery: (See image)

(Changes and errors in the technical data are reserved!)

We would be happy to answer any further questions by phone.